InnoSys has extensive experience and capability in and facilities for advanced microfabrication, i.e., microelectronics, micro-electro-mechanical system (MEMS), micro system technology (MST), and micro-machining manufacturing. Understanding the importance of package design in the performance/cost ratio of advanced electronic systems, our microfabrication capability is further enhanced with InnoSys’ advanced packaging technologies which include our unique vacuum packaging through our unique precision ceramic metallization and vacuum sealing techniques. The company is especially proud of its system level modeling/simulation/design capability which utilizes both commercial and in-house software to study and develop our designs. InnoSys is further equipped with advanced characterization (optical microscopes, scanning electronmicroscopes, etc.) and testing equipment (dc, high frequency, high voltage, high temperature, and optical) for not only product development but also component/part inspection and quality control.